
According to Samsung, its 512 GB DDR5 memory module offers more than twice the performance of DDR4, with up to 7,200 megabits per second (Mbps). This, says the company, will be beneficial for the most demanding computing and high-bandwidth workloads.
“Samsung is the only semiconductor company with logic and memory capabilities and the experience to incorporate cutting-edge HKMG logic technology in the development of memory products,” said Young-Soo Sohn, vice president, Planning / Enabling Group of DRAM Memory from Samsung Electronics. “By bringing this type of process innovation to DRAM manufacturing, we are able to offer our customers high-performance, low-power memory solutions to power the computers needed for medical research, financial markets, autonomous driving, cities smart and more. “

Of course, we are all excited about what DDR5 can offer on the consumer side, with the upcoming platforms from AMD and Intel. In this case, however, Samsung is targeting data center environments and other professional segments to handle advanced workloads in supercomputing, artificial intelligence (AI), machine learning (ML), data analysis and so on.
The 512 GB capacity is achieved by stacking eight layers of 16 gigabit (Gb) DRAM chips. There is no mention of cost, although Samsung says it is currently testing its 512GB modules for customers for testing and verification.